| US 7,536,762 B2 | ||
| Method of manufacturing an ink-jet assembly | ||
| Koji Imai, Inyuama (Japan); and Yuji Shinkai, Handa (Japan) | ||
| Assigned to Brother Kogyo Kabushiki Kaisha, Nagoya-shi, Aichi-ken (Japan) | ||
| Filed on Jan. 30, 2006, as Appl. No. 11/341,639. | ||
| Claims priority of application No. 2005-022841 (JP), filed on Jan. 31, 2005. | ||
| Prior Publication US 2006/0187649 A1, Aug. 24, 2006 | ||
| Int. Cl. H05K 3/34 (2006.01); B21D 53/76 (2006.01) | ||
| U.S. Cl. 29—25.35 [29/890.1; 29/840; 29/843; 29/860; 228/175; 228/180.1; 347/50; 347/70] | 4 Claims |
| 1. A method for manufacturing a board assembly comprising the steps of:
tin-plating a first terminal and a copper-made second terminal that are formed on a circuit board;
mounting an electronic component on the circuit board by means of gold-tin eutectic bonding between a gold electrode of the
electronic component and the tin-plated first terminal;
forming a copper-tin alloy on a surface of the second terminal by heating the circuit board after the mounting step; and
bonding the second terminal having the copper-tin alloy formed on the surface of the second terminal to another terminal of
another board by means of a thermosetting conductive adhesive.
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