| US 7,535,108 B2 | ||
| Electronic component including reinforcing member | ||
| Munehide Saimen, Sakata (Japan) | ||
| Assigned to Seiko Epson Corporation, (Japan) | ||
| Filed on Oct. 10, 2005, as Appl. No. 11/247,611. | ||
| Claims priority of application No. 2004-334405 (JP), filed on Nov. 18, 2004. | ||
| Prior Publication US 2006/0103027 A1, May 18, 2006 | ||
| Int. Cl. H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01) | ||
| U.S. Cl. 257—773 [257/784; 257/774; 257/775; 257/776] | 13 Claims |
| 1. An electronic component, comprising:
a base substrate having a first surface and a second surface;
a wiring pattern positioned on the first surface of the base substrate;
a reinforcing member positioned on the second surface of the base substrate;
a reinforcing sticker positioned on the first surface of the base substrates; and
a semiconductor chip positioned on the first surface of the base substrate, a portion of the wiring pattern being positioned
between the semiconductor chip and the first surface of the base substrate, and the reinforcing member not overlapping with
the semiconductor chip.
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