| US 7,534,658 B2 | ||
| Process for manufacturing microelectronic, microoptoelectronic or micromechanical devices | ||
| Marco Amiotti, Milan (Italy) | ||
| Assigned to SAES Getters S.p.A., Lainate (Milan) (Italy) | ||
| Filed on Feb. 25, 2005, as Appl. No. 11/67,526. | ||
| Application 11/067526 is a division of application No. 10/201657, filed on Jul. 19, 2002, granted, now 6,897,551. | ||
| Claims priority of application No. MI01A001558 (IT), filed on Jul. 20, 2001; and application No. MI02A000688 (IT), filed on Apr. 03, 2002. | ||
| Prior Publication US 2005/0158914 A1, Jul. 21, 2005 | ||
| Int. Cl. H01L 23/20 (2006.01) | ||
| U.S. Cl. 438—115 [438/125] | 29 Claims |
| 1. A process for manufacturing a device for use in the production of a microdevice including the steps of:
creating a support device by deposing discrete deposits of contaminant removing material on a base layer of a material selected
from the group consisting of glasses, ceramics, semiconductors and metals, wherein said contaminant removing material is selected
among the group of materials consisting of getter materials and drier materials;
covering said contaminant removing material by a manufacturing layer, wherein said manufacturing layer is a substrate layer
which may be used in the manufacture of said microdevice;
removing selected materials in said manufacturing layer creating a passage in said manufacturing layer, such that said contaminant
removing material is exposed to atmosphere, wherein said passages create; and
attaching said support device such that it covers operational parts of said microdevice and a seal is created at the periphery
of said cavity by said support device and said microdevice, whereby said operational parts are placed in said cavity from
removed layer of manufacturing material.
|