US D592,230 S
Wafer carrying-in/out machine
Hiroki Hosaka, Nirasaki (Japan); Shuji Akiyama, Nirasaki (Japan); and Tadashi Obikane, Nirasaki (Japan)
Assigned to Tokyo Electron Limited, Tokyo (Japan)
Filed on Nov. 16, 2007, as Appl. No. 29/297,744.
Claims priority of application No. 2007-012947 (JP), filed on May 16, 2007.
Term of patent 14 Years
LOC (9) Cl. 15 - 99
U.S. Cl. D15—199  [D13/182]
OG exemplary drawing
 
The ornamental design for a wafer carrying-in/out machine, as shown and described.