| US 7,532,952 B2 | ||
| Methods and apparatus for pressure control in electronic device manufacturing systems | ||
| Mark W. Curry, Morgan Hill, Calif. (US); Sebastien Raoux, Santa Clara, Calif. (US); and Peter Porshnev, San Jose, Calif. (US) | ||
| Assigned to Applied Materials, Inc., Santa Clara, Calif. (US) | ||
| Filed on Mar. 14, 2007, as Appl. No. 11/686,012. | ||
| Claims priority of provisional application 60/890609, filed on Feb. 19, 2007. | ||
| Claims priority of provisional application 60/783374, filed on Mar. 16, 2006. | ||
| Claims priority of provisional application 60/783370, filed on Mar. 16, 2006. | ||
| Claims priority of provisional application 60/783337, filed on Mar. 16, 2006. | ||
| Prior Publication US 2007/0260351 A1, Nov. 08, 2007 | ||
| Int. Cl. G05D 11/00 (2006.01) | ||
| U.S. Cl. 700—282 | 12 Claims |
| 1. A method of equilibrating corresponding vacuum line parameters in an electronic device manufacturing system including a
pump comprising:
acquiring information related to a parameter of a first vacuum line and information related to a parameter of a second vacuum
line, wherein the first and second vacuum lines are fluidically separate;
comparing the information related to the parameter of the first vacuum line with the information related to the parameter
of the second vacuum line; and
adjusting at least one parameter of the pump such that corresponding parameters of the first and second vacuum lines are equilibrated.
|