US 7,532,795 B2
Radiation-curable liquid resin composition
Atsuya Takahashi, Tsuchiura (Japan); Takeo Shigemoto, Chiba (Japan); Zen Komiya, Tsukuba (Japan); and Hiroki Ohara, Tsukuba (Japan)
Assigned to DSM IP Assets B.V., Heerlen (Netherlands); and JSR Corporation, Tokyo (Japan)
Appl. No. 10/568,453
PCT Filed Aug. 20, 2004, PCT No. PCT/NL2004/000589
§ 371(c)(1), (2), (4) Date Jan. 18, 2007,
PCT Pub. No. WO2005/019128, PCT Pub. Date Mar. 03, 2005.
Claims priority of application No. 2003-296196 (JP), filed on Aug. 20, 2003; and application No. 2003-326601 (JP), filed on Sep. 18, 2003.
Prior Publication US 2007/0191505 A1, Aug. 16, 2007
Int. Cl. B32B 17/02 (2006.01); G02B 6/02 (2006.01); G02B 6/04 (2006.01); G02B 6/036 (2006.01); G02B 6/44 (2006.01); C08L 75/16 (2006.01); C09D 175/16 (2006.01); C08F 290/06 (2006.01); C08F 2/46 (2006.01)
U.S. Cl. 385—114  [385/115; 428/378; 526/301; 522/96; 522/173] 16 Claims
 
1. A radiation-curable liquid resin composition comprising:
(A) 20-90 wt % of a urethane(meth)acrylate oligomer component comprised of at least first and second different urethane(meth)acrylate oligomers, wherein the first urethane(meth)acrylate oligomer is present in an amount of 10-80 wt. % and is the reaction product of a polyisocyanate compound (b) and a hydroxy-functional ethylenically unsaturated monomer (c), and
(B) 1-35 wt % of a monomer component according to the following formula (1),

OG Complex Work Unit Drawing
wherein R1 represents a hydrogen atom or a methyl group, R2 and R3 individually represent a hydrogen atom or an alkyl group having 1-4 carbon atoms, R4 represents a hydrogen atom or a methyl group, and n represents an integer of 1-6.