| US 7,532,479 B2 | ||
| Spread illuminating apparatus | ||
| Yasuo Ohno, Kitasaku-gun (Japan); and Chiharu Ota, Kitasaku-gun (Japan) | ||
| Assigned to Minebea Co., Ltd., Kitasaku (Japan) | ||
| Filed on Feb. 20, 2007, as Appl. No. 11/707,884. | ||
| Claims priority of application No. 2006-052264 (JP), filed on Feb. 28, 2006. | ||
| Prior Publication US 2007/0201247 A1, Aug. 30, 2007 | ||
| Int. Cl. H05K 7/20 (2006.01) | ||
| U.S. Cl. 361—719 [257/706; 257/712; 361/720; 362/631] | 3 Claims |
| 1. A spread illuminating apparatus comprising:
a light conductor plate;
a point light source disposed at a side surface of the light conductor plate; and
a printed circuit board having a pair of lands formed on a front side thereof in which the pair of lands is provided so as
to communicate with a conductive pattern and having the point light source mounted on the front side, wherein
the point light source is attached to the pair of lands through electrode terminals of the point light source, each of the
electrode terminals being sandwiched between the point light source and one of the lands,
a throughhole is formed in each of the lands,
solder is contained at least partly in the throughholes,
a recess is formed between the pair of lands on the front side of the printed circuit board,
a bottom of the recess is defined by a portion of the conductive pattern, and
heat conductive resin is filled in a space defined by the recess and a surface of the point light source facing the printed
circuit board.
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