| US 7,532,453 B2 | ||
| Built-in capacitor type wiring board and method for manufacturing the same | ||
| Hiroshi Yamamoto, Konan (Japan); Toshitake Seki, Aichi (Japan); Yasuhiko Inui, Kani (Japan); Jun Otsuka, Konan (Japan); and Manabu Sato, Nagoya (Japan) | ||
| Assigned to NGK Spark Plug Co., Ltd., Aichi (Japan) | ||
| Filed on Nov. 20, 2006, as Appl. No. 11/601,760. | ||
| Claims priority of application No. 2005-344925 (JP), filed on Nov. 30, 2005. | ||
| Prior Publication US 2007/0121273 A1, May 31, 2007 | ||
| Int. Cl. H01G 4/228 (2006.01) | ||
| U.S. Cl. 361—306.2 [361/306.1; 361/306.3; 361/311; 361/313; 361/321.2] | 9 Claims |
| 1. A built-in capacitor type wiring board, comprising:
a core board;
a multilayer portion formed on at least one side of said core board and comprising a plurality of interlayer insulating layers
and a plurality of conductor layers alternately laminated on said core board; and
a capacitor of a chip-like shape having a first main surface and a second main surface, said capacitor comprising:
a dielectric layer;
an electrode layer laminated on said dielectric layer; and
at least one non-via hole opening at least at said second main surface,
wherein said capacitor is embedded in said interlayer insulating layers so that said second main surface faces said core board.
|