US 7,532,310 B2
	Apparatus, method for supporting and/or thermally conditioning a substrate, a support table, and a chuck
Jeroen Johannes Sophia Maria Mertens, Duizel (Netherlands); Aschwin Lodewijk Hendricus Johannes Van Meer, Roosendaal (Netherlands); Joost Jeroen Ottens, Veldhoven (Netherlands); and Edwin Van Gompel, Valkenswaard (Netherlands)
Assigned to ASML Netherlands B.V., Veldhoven (Netherlands)
Filed on Oct. 22, 2004, as Appl. No. 10/970,658.
Prior Publication US 2006/0102849 A1, May 18, 2006
Int. Cl. G03B 27/58 (2006.01); G03B 27/62 (2006.01)

U.S. Cl. 355—72  [355/75]

35 Claims

1. An apparatus comprising a support table for supporting a substrate, said support table comprising a plurality of support protrusions for supporting the substrate, and a plurality of heat transfer protrusions extending towards the substrate without contacting the substrate when said substrate is supported by said support protrusions, wherein gas-containing heat exchanging gaps for exchanging heat with the substrate extend between the heat transfer protrusions and the substrate, wherein said support table and said support and heat transfer protrusions, together with the substrate, are arranged to substantially enclose a first space, and wherein said heat exchanging gaps are part of said first space.