| US 7,532,131 B2 | ||
| Multi-layer solid state keyboard | ||
| William David Schaefer, 2121 Finsbury La., Grand Rapids, Mich. 49504 (US); and David W. Caldwell, 16253 Ranson St., Holland, Mich. 49424 (US) | ||
| Filed on Apr. 22, 2004, as Appl. No. 10/829,493. | ||
| Application 10/829493 is a continuation in part of application No. 10/272377, filed on Oct. 15, 2002, granted, now 7,218,498. | ||
| Claims priority of provisional application 60/464483, filed on Apr. 22, 2003. | ||
| Claims priority of provisional application 60/341551, filed on Dec. 18, 2001. | ||
| Claims priority of provisional application 60/334040, filed on Nov. 20, 2001. | ||
| Prior Publication US 2005/0062620 A1, Mar. 24, 2005 | ||
| Int. Cl. H03K 17/96 (2006.01) | ||
| U.S. Cl. 341—22 [200/5 A; 200/512; 200/600; 345/173] | 30 Claims |

| 1. A solid state keyboard formed by:
(a) depositing a layer of decorative material onto at least a portion of a substrate;
(b) depositing a first layer of conductive material onto at least a portion of the structure resulting from step (a), said
first layer of conductive material being arranged in the form of a first sensor electrode;
(c) depositing a second layer of conductive material onto at least a portion of the structure resulting from step (b), at
least a portion of said second layer of conductive material overlying and being electrically coupled to at least a portion
of said first layer of conductive material, said second layer of conductive material being arranged in the form of a first
bonding pad and a first electrical trace coupling said first sensing electrode to said first bonding pad; and
(d) connecting a first electrical circuit component to said first bonding pad.
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