| US 7,531,801 B2 | ||
| Solder material test method and apparatus, control program and computer-readable recording medium | ||
| Katsumi Ohashi, Kyoto (Japan); Masanobu Horino, Kyoto (Japan); and Yasuhiro Onishi, Kyoto (Japan) | ||
| Assigned to OMRON Corporation, Kyoto-Shi (Japan) | ||
| Filed on Feb. 17, 2006, as Appl. No. 11/356,437. | ||
| Claims priority of application No. 2005-046284 (JP), filed on Feb. 22, 2005. | ||
| Prior Publication US 2008/0156990 A1, Jul. 03, 2008 | ||
| Int. Cl. G01J 5/02 (2006.01) | ||
| U.S. Cl. 250—341.1 | 23 Claims |
| 1. A solder material test method including:
a first detecting step of detecting a first intensity at a particular wave number of infrared ray reflected from a test-sample
solder material by illuminating light to the test-sample solder material; and
a test step of testing a deterioration degree of the test-sample solder material relatively to a comparative-sample solder
material, depending upon the first intensity detected.
|