| US 7,531,757 B2 | ||
| IC card and semiconductor integrated circuit device package | ||
| Takuya Takahashi, Tokyo (Japan); Kazuhiro Yamamoto, Naka-gun (Japan); and Minoru Ohara, Ome (Japan) | ||
| Assigned to Kabushiki Kaisha Toshiba, Tokyo (Japan) | ||
| Filed on Feb. 26, 2008, as Appl. No. 12/37,713. | ||
| Application 12/037713 is a continuation of application No. 10/442959, filed on May 22, 2003, granted, now 7,351,920. | ||
| Claims priority of application No. 2002-147914 (JP), filed on May 22, 2002. | ||
| Prior Publication US 2008/0158835 A1, Jul. 03, 2008 | ||
| Int. Cl. H01L 23/28 (2006.01) | ||
| U.S. Cl. 174—521 [361/737; 257/679] | 7 Claims |
| 1. An IC card, comprising:
a semiconductor integrated circuit device package having one surface and another surface opposite to the one surface, which
includes a wiring board, a semiconductor integrated circuit chip on the wiring board, and an insulating resin coated over
the semiconductor integrated circuit chip to form the other surface of the integrated circuit device package;
card terminals on the one surface of the semiconductor integrated circuit device package, the card terminals being electrically
connected to the semiconductor integrated circuit chip, the card terminals being rectangular and extending in parallel to
each other, an outermost of the card terminals being wider than the other terminals; and
a base card, including a concave portion, attached to the other surface of the semiconductor integrated circuit device package,
the base card including a card terminal surface and an opposite surface,
wherein side walls of the semiconductor integrated circuit device package are spaced apart from the base card, and
the card terminal surface of the base card includes a rib projecting from the card terminal surface on an end of the card
terminal surface opposite to the apparatus insertion surface.
|