| US 7,531,755 B2 | ||
| Trimming of embedded structures | ||
| Olli Salmela, Helsinki (Finland); and Ilpo Kokkonen, Oulu (Finland) | ||
| Assigned to Nokia Corporation, Espoo (Finland) | ||
| Filed on Jun. 20, 2005, as Appl. No. 11/155,572. | ||
| Application 11/155572 is a continuation of application No. 10/297762, granted, now 6,921,868, previously published as PCT/FI01/00411, filed on Apr. 27, 2001. | ||
| Claims priority of application No. 20001384 (FI), filed on Jun. 09, 2000. | ||
| Prior Publication US 2005/0230349 A1, Oct. 20, 2005 | ||
| Int. Cl. H05K 1/16 (2006.01) | ||
| U.S. Cl. 174—260 [361/761] | 9 Claims |
| 1. An apparatus comprising:
a substrate including a cavity disposed therein; and
a conductive element embedded inside the substrate, said conductive element having at least one extension connecting said
conductive element to a further conductive element transverse to said conductive element;
wherein the cavity extends between a surface of the substrate and one of said at least one extension of said conductive element,
and wherein the substrate is configured such that the conductive element is trimmed through the cavity by cutting at least
part of said one of said at least one extension by a trimming element, wherein the conductive element to be trimmed is included
in a resonator.
|