| US 7,531,754 B2 | ||
| Flexible substrate having interlaminar junctions, and process for producing the same | ||
| Yoshihisa Yamashita, Kyoto-fu (Japan); Hiroki Yabe, Moriguchi (Japan); Takashi Ichiryu, Moriguchi (Japan); Seiichi Nakatani, Hirakata (Japan); Satoru Tomekawa, Yokohama (Japan); Toshio Fujii, Neyagawa (Japan); and Seiji Karashima, Hirakata (Japan) | ||
| Assigned to Panasonic Corporation, Osaka (Japan) | ||
| Filed on Mar. 02, 2007, as Appl. No. 11/712,943. | ||
| Application 11/712943 is a division of application No. 11/079371, filed on Mar. 15, 2005, granted, now 7,205,483. | ||
| Claims priority of application No. P2004-079848 (JP), filed on Mar. 19, 2004; application No. P2004-088853 (JP), filed on Mar. 25, 2004; application No. P2004-088854 (JP), filed on Mar. 25, 2004; application No. P2004-318887 (JP), filed on Nov. 02, 2004; and application No. P2004-318888 (JP), filed on Nov. 02, 2004. | ||
| Prior Publication US 2007/0151756 A1, Jul. 05, 2007 | ||
| Int. Cl. H05K 1/00 (2006.01) | ||
| U.S. Cl. 174—254 [174/262; 174/250; 174/255; 174/256; 174/258; 361/790; 361/795] | 11 Claims |
| 1. A flexible substrate comprising:
a first sheet member;
a second sheet member; and
a substrate having a first wiring pattern formed on a front face thereof and a second wiring pattern formed on a rear face
thereof, said rear face being opposite to said front face,
wherein said first sheet member comprises
a first film,
a first insulating resin layer formed on each of a front face of said first film and a rear face of said first film, said
rear face being opposite to said front face, and
a first wiring pattern embedded in said first insulating resin layer formed on said front face of said first film, said first
wiring pattern being flush with said first insulating resin layer,
wherein said first sheet member is stacked on said substrate such that said first insulating resin layer formed on said rear
face of said first film of said first sheet member is in contact with said front face of said substrate,
wherein a part of said first wiring pattern of said first sheet member is dented toward said substrate so that said part of
said first wiring pattern of said first sheet member and a part of said first wiring pattern of said substrate are jointed
to each other to form a junction,
wherein said second sheet member comprises
a second film,
a second insulating resin layer formed on each of a front face of said second film and a rear face of said second film, said
rear face being opposite to said front face, and
a second wiring pattern embedded in said second insulating resin layer formed on said front face of said second film,
wherein said first sheet member is stacked on said front face of said substrate and said second sheet member is stacked on
said rear face of said substrate, and
wherein a part of said second wiring pattern of said second sheet member is dented toward said substrate, so that said part
of said first wiring pattern of said first sheet member stacked on said front face of said substrate and said part of said
second wiring pattern of said second sheet member stacked on said rear face of said substrate are respectively jointed with
said part of said first wiring pattern formed on said front face of said substrate and a part of said second wiring pattern
formed on said rear face of said substrate.
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