| US 7,531,431 B2 | ||
| Methods for reducing contamination of semiconductor devices and materials during wafer processing | ||
| Barry Rayfield, Wake Forest, N.C. (US); Chris Fanelli, Raleigh, N.C. (US); and Mitch Jackson, Raleigh, N.C. (US) | ||
| Assigned to Cree, Inc., Durham, N.C. (US) | ||
| Filed on May 19, 2006, as Appl. No. 11/437,934. | ||
| Prior Publication US 2007/0269980 A1, Nov. 22, 2007 | ||
| Int. Cl. H01L 21/00 (2006.01) | ||
| U.S. Cl. 438—460 [438/464; 438/465; 438/770; 257/E21.599; 257/E21.602] | 41 Claims |
| 1. A method of operating a dicing saw including a rotary saw blade and configured to saw a semiconductor substrate, the method
comprising:
flowing a mixture of water and an oxidizing agent over the semiconductor substrate, wherein the mixture further comprises
a catalyst or oxidation enhancing agent; and
sawing the semiconductor substrate with the dicing saw; wherein sawing the semiconductor substrate is performed while flowing
the mixture over the semiconductor substrate.
|