| US 7,531,101 B2 | ||
| Method for eliminating punctual defects comprised in an electrochemical device | ||
| Fabien Beteille, Revel (France) | ||
| Assigned to Saint-Gobain Glass France, Courbevoie (France) | ||
| Appl. No. 10/530,285 PCT Filed Oct. 01, 2003, PCT No. PCT/FR03/02871 § 371(c)(1), (2), (4) Date Oct. 06, 2006, PCT Pub. No. WO2004/034138, PCT Pub. Date Apr. 22, 2004. |
||
| Claims priority of application No. 02 12520 (FR), filed on Oct. 09, 2002. | ||
| Prior Publication US 2007/0141360 A1, Jun. 21, 2007 | ||
| Int. Cl. C03C 15/00 (2006.01) | ||
| U.S. Cl. 216—33 [216/59; 216/65] | 12 Claims |
| 1. A method of eliminating, using a laser beam of laser radiation, pinhole defects lying within a laminate formed from at
least a first substrate and from at least a second substrate, the laminate incorporating, between the first and second substrates,
at least one active system, the method comprising:
locating at least one pinhole defect lying within the active system; and
ablating the pinhole defect through at least one of the first or second substrates, by circumscribing the pinhole defect using
the laser beam, the ablating the defect electrically isolating a peripheral region of the pinhole defect relative to the active
system including the pinhole defect.
|