| US 7,531,050 B2 | ||
| Method for manufacturing bonded magnet and method for manufacturing magnetic device having bonded magnet | ||
| Shigun Oh, Sendai (Japan); Teruhiko Fujiwara, Sendai (Japan); Yasubumi Kikuchi, Sendai (Japan); and Takashi Yambe, Sendai (Japan) | ||
| Assigned to Nec Tokin Corporation, Sendai-Shi (Japan) | ||
| Appl. No. 10/528,305 PCT Filed Sep. 19, 2003, PCT No. PCT/JP03/11970 § 371(c)(1), (2), (4) Date Jul. 20, 2005, PCT Pub. No. WO2004/027795, PCT Pub. Date Apr. 01, 2004. |
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| Claims priority of application No. 2002-273362 (JP), filed on Sep. 19, 2002; and application No. 2003-019892 (JP), filed on Jan. 29, 2003. | ||
| Prior Publication US 2006/0280921 A1, Dec. 14, 2006 | ||
| Int. Cl. H01F 1/08 (2006.01); H01F 1/055 (2006.01) | ||
| U.S. Cl. 148—103 [148/104] | 15 Claims |
| 1. A method of manufacturing a bond magnet, wherein:
an alloy magnetic powder magnetized in advance by applying a magnetic field ranging from 5 T to 10 T is mixed with a resin
at a weight ratio within a range from 70:30 to 97:3 to obtain a viscous material with 10 poises or more,
the viscous material is located at a predetermined position of a magnetic device in contact therewith, and
a magnetic field ranging from 30 mT to 500 mT is applied to the viscous material to magnetically orient the alloy magnetic
powder included in the viscous material while the resin is hardened.
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