| US 7,531,016 B2 | ||
| Chemical reaction apparatus and power supply system | ||
| Tadao Yamamoto, Tokyo (Japan); Osamu Nakamura, Kodaira (Japan); Keishi Takeyama, Hamura (Japan); and Tsutomu Terazaki, Fussa (Japan) | ||
| Assigned to Casio Computer Co., Ltd., Tokyo (Japan) | ||
| Appl. No. 10/477,576 PCT Filed Mar. 19, 2003, PCT No. PCT/JP03/03364 § 371(c)(1), (2), (4) Date Nov. 12, 2003, PCT Pub. No. WO03/082460, PCT Pub. Date Oct. 09, 2003. |
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| Claims priority of application No. 2002-094271 (JP), filed on Mar. 29, 2002; and application No. 2003-069442 (JP), filed on Mar. 14, 2003. | ||
| Prior Publication US 2004/0148858 A1, Aug. 05, 2004 | ||
| Int. Cl. B01J 8/00 (2006.01) | ||
| U.S. Cl. 48—127.9 [422/190; 422/193; 422/198] | 26 Claims |
| 1. A chemical reaction apparatus comprising:
a plurality of substrates which are bonded to each other and which are heatable;
at least one flow path which is formed in at least one of the plurality of substrates, and through which a fluid flows, the
flow path including an inlet opening and an outlet opening which are exposed on an outermost surface of the at least one of
the plurality of substrates;
a heating element which is formed on at least one surface of at least one of the plurality of substrates to heat said plurality
of substrates and to heat the flow path to a predetermined temperature so that a chemical reaction of the fluid flowing through
the flow path is accelerated; and
a heat radiation preventing film which contacts and covers at least a portion of one of: (i) the outermost surface of the
at least one of the plurality of substrates and (ii) an outermost surface of the heating element to reflect at least a part
of heat rays reflected from said outermost surfaces to thereby prevent lowering of a temperature of the flow path;
wherein the heat radiation preventing film comprises at least one of: (i) a metal film made of Au, Al, or Ag, and (ii) a metal
oxide film made of SnO2, InO3, or ZnO;
wherein the plurality of substrates include at least a first substrate having a first surface in which the flow path is formed,
and a second substrate bonded to the first surface of the first substrate;
wherein the heating element comprises a thin-film heater, and the thin-film heater is formed on at least one of: a first surface
of the second substrate that opposes the first substrate, a second surface of the second substrate away from the first surface
of the second substrate, and a second surface of the first substrate away from the first surface of the first substrate;
wherein the heating element further comprises an electrically insulating film provided on the surface on which the thin-film
heater is formed, and the electrically insulating film covers the thin-film heater and has a flat surface opposite to a surface
thereof covering the thin-film heater;
wherein the thin-film heater is formed on at least one of the second surface of the second substrate and the second surface
of the first substrate;
wherein the plurality of substrates include a third substrate bonded onto the electrically insulating film which covers the
thin-film heater;
wherein the heat radiation preventing film is formed on an outer surface of the third substrate; and
wherein the third substrate has a recess in a surface which opposes the thin-film heater.
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