| US 7,530,235 B2 | ||
| Heat pump, heat pump system, method of pumping refrigerant, and rankine cycle system | ||
| Hiroshi Yamaguchi, Kyoto (Japan); Katsumi Fujima, Tsukuba (Japan); Masatoshi Enomoto, Oyama (Japan); and Noboru Sawada, Tokyo (Japan) | ||
| Assigned to The Doshisha, (Japan); Mayekawa Mfg. Co. Ltd., (Japan); Showa Denko K.K., (Japan); Showa Tansan Co., Ltd., (Japan); and Yoshimura Construction Co., Ltd., (Japan) | ||
| Filed on Mar. 15, 2007, as Appl. No. 11/686,857. | ||
| Application 11/686857 is a continuation of application No. PCT/JP2005/016834, filed on Sep. 13, 2005. | ||
| Claims priority of application No. 2004-272597 (JP), filed on Sep. 17, 2004. | ||
| Prior Publication US 2007/0199323 A1, Aug. 30, 2007 | ||
| Int. Cl. F25B 23/00 (2006.01) | ||
| U.S. Cl. 62—467 [62/513; 60/671] | 15 Claims |
| 1. A pump apparatus comprising:
a closed vessel;
a refrigerant introduction path connected to the vessel at a lower part of the vessel;
a valve disposed in the refrigerant introduction path;
a refrigerant discharge path connected to the vessel at an upper part of the vessel;
a pressure regulating valve disposed in the refrigerant discharge path that opens at a predetermined pressure;
a temperature regulating device for heating and cooling a refrigerant into the closed vessel; and
a conduit connecting to the refrigerant discharge path or to the upper part of the closed vessel and a valve for decreasing
the pressure in the closed vessel and allowing introduction of the refrigerant into the closed vessel through the conduit;
wherein the temperature regulating device includes a cooling apparatus disposed inside the closed vessel in an upper region
of the closed vessel, and a heating apparatus disposed inside the closed vessel in a lower region of the closed vessel.
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