| US 7,529,093 B2 | ||
| Circuit device | ||
| Noriaki Sakamoto, Gunma (Japan) | ||
| Assigned to Sanyo Electric Co., Ltd., Osaka (Japan) | ||
| Filed on Nov. 28, 2005, as Appl. No. 11/164,522. | ||
| Claims priority of application No. 2004-342657 (JP), filed on Nov. 26, 2004. | ||
| Prior Publication US 2007/0240899 A1, Oct. 18, 2007 | ||
| Int. Cl. H05K 7/20 (2006.01) | ||
| U.S. Cl. 361—715 [174/252; 174/260; 174/261; 361/742; 361/790; 361/799] | 10 Claims |
| 1. A circuit device, comprising:
a circuit board made of metal having
a first insulating layer covering an entire front surface of the circuit board, and
a second insulating layer covering an entire rear surface of the circuit board;
an electric circuit constituted of a conductive pattern and a circuit element, both of which are formed on the surface of
the first insulating layer;
sealing resin for encapsulating the electric circuit, the sealing resin covers the front and side surfaces of the circuit
board as well as the edge region of the rear surface of the circuit board, with the second insulating layer being partially
exposed; and
a metal board fixed to the rear surface of the second insulating layer and a rear surface of the metal board is exposed from
the sealing resin,
wherein a metal material of the circuit board is exposed at a side surface of the circuit board and separated from the metal
board.
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