| US 7,528,854 B2 | ||
| Device including light-emitting elements above a glass substrate | ||
| Kazunori Sakurai, Chino (Japan) | ||
| Assigned to Seiko Epson Corporation, Tokyo (Japan) | ||
| Filed on Jul. 13, 2005, as Appl. No. 11/179,661. | ||
| Claims priority of application No. 2004-226371 (JP), filed on Aug. 03, 2004. | ||
| Prior Publication US 2006/0028535 A1, Feb. 09, 2006 | ||
| Int. Cl. B41J 2/45 (2006.01); B41J 2/385 (2006.01) | ||
| U.S. Cl. 347—238 [347/130] | 20 Claims |
| 1. A device comprising:
an element substrate having a glass substrate and light-emitting elements arrayed above a first side of the glass substrate;
a sealing substrate that seals the light-emitting elements above the glass substrate, and
an adhesive resin that joins the sealing substrate to the element substrate, the adhesive resin being disposed between the
sealing substrate and the light-emitting elements,
wherein a recess is formed on a portion of a second side of the glass substrate that is opposite to the first side of the
glass substrate arrayed with the light emitting elements, light emitted from the light-emitting elements emits from the second
side of the glass substrate, and the recess is formed to include an entire region immediately above at least the light-emitting
elements.
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