| US 7,527,723 B2 | ||
| Electrolytic processing apparatus and electrolytic processing method | ||
| Itsuki Kobata, Tokyo (Japan); Yutaka Wada, Tokyo (Japan); Hirokuni Hiyama, Fujisawa (Japan); Takayuki Saito, Fujisawa (Japan); Yasushi Toma, Fujisawa (Japan); Tsukuru Suzuki, Fujisawa (Japan); and Akira Kodera, Fujisawa (Japan) | ||
| Assigned to Ebara Corporation, Tokyo (Japan) | ||
| Filed on Jan. 14, 2005, as Appl. No. 11/35,373. | ||
| Claims priority of application No. 2004-009655 (JP), filed on Jan. 16, 2004; and application No. 2004-318380 (JP), filed on Nov. 01, 2004. | ||
| Prior Publication US 2005/0155868 A1, Jul. 21, 2005 | ||
| Int. Cl. B23H 7/36 (2006.01); B23H 1/10 (2006.01); B23H 3/10 (2006.01) | ||
| U.S. Cl. 205—668 [205/640; 205/651; 205/654; 205/660; 205/663] | 6 Claims |
| 1. An electrolytic processing method comprising:
disposing a workpiece, to which electricity is fed from a feeding electrode, and a processing electrode such that they are
not in contact with and close to each other at a distance of not more than 10 μm;
supplying a liquid containing an ion-exchange material between the workpiece and at least one of the processing electrode
and the feeding electrode so that the liquid flows therebetween, the ion-exchange material having a smaller size than the
distance between the workpiece and the at least one of the processing electrode and the feeding electrode, and being present
in a particulate or gel-like form in the liquid;
applying a voltage between the processing electrode and the feeding electrode; and
moving the workpiece and at least one of the processing electrode and the feeding electrode relative to each other.
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