US 7,525,807 B2
Semiconductor memory device
Haruo Ohta, Kyotanabe (Japan); and Takeshi Ohtsuka, Nishinomiya (Japan)
Assigned to Panasonic Corporation, Osaka (Japan)
Appl. No. 10/554,103
PCT Filed Dec. 11, 2003, PCT No. PCT/JP03/15833
§ 371(c)(1), (2), (4) Date Oct. 21, 2005,
PCT Pub. No. WO2004/095363, PCT Pub. Date Nov. 04, 2004.
Claims priority of application No. 2003-118242 (JP), filed on Apr. 23, 2003.
Prior Publication US 2006/0221711 A1, Oct. 05, 2006
Int. Cl. H05K 1/14 (2006.01)
U.S. Cl. 361—737  [361/715] 12 Claims
OG exemplary drawing
 
1. A semiconductor memory device comprising:
a plurality of semiconductor memory cards arranged in a rectangular shape, each semiconductor memory card having first edge portions disposed along the lengths of two parallel edges of said semiconductor memory card, the first edge portions being thinner than a central portion of said semiconductor memory card;
a housing for said plurality of semiconductor memory cards, said housing having:
a substantially rectangular shape so as to have a smaller axis and a larger axis, and
second edge portions disposed along the lengths of two parallel edges of said housing, said second edge portions being thinner than a central portion of said housing, two of said plurality of semiconductor memory cards being disposed flat and adjacent to each other along the smaller axis of said housing, and so that one of said first edge portions of each of said two semiconductor memory cards lies in a respective one of said second edge portions of said housing;
a connecting section in said housing for connecting to a host device; and
a controller in said housing for controlling transmission and reception of a signal between said connecting section and said plurality of semiconductor memory cards.