| US 7,525,802 B2 | ||
| Computer with heat dissipation system | ||
| Hui Yu, Shenzhen (China); and Mu-Chang Wang, Taipei Hsien (Taiwan) | ||
| Assigned to Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Shenzhen, Guangdong Province (China); and Hon Hai Precision Industry Co., Ltd., Tu-Cheng, Taipei Hsien (Taiwan) | ||
| Filed on Aug. 15, 2007, as Appl. No. 11/838,904. | ||
| Claims priority of application No. 2007 1 0200980 (CN), filed on Jul. 02, 2007. | ||
| Prior Publication US 2009/0009966 A1, Jan. 08, 2009 | ||
| Int. Cl. H05K 7/20 (2006.01); F28F 7/00 (2006.01) | ||
| U.S. Cl. 361—701 [165/80.3; 165/104.33; 361/695; 361/700] | 10 Claims |
| 1. A computer comprising:
a motherboard with a first heat generating device mounted thereon;
an enclosure having a substantially sealed first compartment, and an airflow chamber in communication with an exterior of
the enclosure, the first compartment receiving the first heat generating device therein, the first compartment having a first
heat exchanger for conducting heat from an interior of the first compartment to the airflow chamber;
a fan arranged in the airflow chamber; and
at least one heat pipe having a first end thermally coupled to the first heat generating device and an opposite second end
thermally coupled to the first heat exchanger.
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