| US 7,525,705 B2 | ||
| Continually variable demetallization of metallized films and similar objects | ||
| William C. Morwald, Langhorne, Pa. (US); and Brian Mentz, Hamden, Conn. (US) | ||
| Assigned to JDS Uniphase Corporation, Milpitas, Calif. (US) | ||
| Filed on Nov. 03, 2005, as Appl. No. 11/267,082. | ||
| Claims priority of provisional application 60/624813, filed on Nov. 03, 2004. | ||
| Prior Publication US 2006/0114530 A1, Jun. 01, 2006 | ||
| Int. Cl. G03H 1/00 (2006.01); B42D 15/00 (2006.01) | ||
| U.S. Cl. 359—2 [283/86] | 26 Claims |
| 1. A method of forming a plurality of laminate patches in a demetallized holographic web, comprising the steps of:
for each of the laminate patches, imparting a same holographic microstructure pattern to an oligomer disposed on a surface
of a substrate;
depositing a metal layer to said holographic microstructure patterns of said substrate to provide a metallized holographic
web;
applying a resist pattern to said metal layer of said metallized holographic web; and
removing said metal layer not covered by said resist pattern so as to form a demetallized pattern on each of the holographic
microstructure patterns whereby forming the plurality of laminate patches in the demetallized holographic web;
wherein, the demetallized pattern includes a fixed demetallization pattern and a variable demetallization pattern; and, for
any first and second of the laminate patches,
the fixed demetallization pattern of the first laminate patch and the fixed demetallization pattern of the second laminate
patch are a same pattern; and
the variable demetallization pattern of the first laminate patch is different from the variable demetallization pattern of
the second laminate patch.
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