US 7,525,303 B2
Automatic testing apparatus and method
Chuan-Bang Wang, Shenzhen (China); Yu-Ping Wu, Shenzhen (China); Yan-Kai Zhang, Shenzhen (China); and Jun She, Shenzhen (China)
Assigned to Innocom Technology (Shenzhen) Co., Ltd., Shenzhen, Guangdong Province (China); and Innolux Display Corp., Miao-Li County (Taiwan)
Filed on Jun. 12, 2006, as Appl. No. 11/451,184.
Claims priority of application No. 94119220 A (TW), filed on Jun. 10, 2005.
Prior Publication US 2006/0279307 A1, Dec. 14, 2006
Int. Cl. G01R 31/28 (2006.01)
U.S. Cl. 324—158.1 5 Claims
OG exemplary drawing
 
1. An automatic testing apparatus comprising:
a transmission floor having a plurality of rollers positioned at two sides thereof;
a board positioned on the rollers, the board comprising an I/O (input/output) circuit for electrically connecting to a device to be tested, and a first connector electrically connected to the I/O circuit;
a stopping unit positioned at the transmission floor; and
a testing device positioned beside the transmission floor, the testing device comprising a second connector matable with the first connector;
wherein the second connector is configured to move and connect with the first connector and thereby form a plurality of signal channels in cooperation with the first connector; the first connector comprises a plurality of metal pads arranged in an array, and the second connector comprises a plurality of metal probes arranged in an array corresponding to the array of the first connector;
wherein a first positioning mechanism is used to adjust the position of the second connector relative to the first connector,
wherein the first positioning mechanism comprises a positioning post a with tapered bottom end provided with the second connector, and a positioning hole corresponding to the positioning post provided with the first connector, a diameter of the positioning hole being slightly greater than a diameter the positioning post; and the positioning post is longer than the metal probes; and
wherein the second connector further comprises a first air driven device configured for moving the metal probes to connect with the metal pads of the first connector, and the second positioning mechanism comprises a second air driven device having a positioning head, the second air driven device being configured for moving the positioning head and thereby adjusting a position of the board relative to the testing device.