| US 7,525,219 B2 | ||
| Providing power to a module | ||
| Edoardo Campini, Mesa, Ariz. (US); William Handley, Chandler, Ariz. (US); and Javier Leija, Chandler, Ariz. (US) | ||
| Assigned to Intel Corporation, Santa Clara, Calif. (US) | ||
| Filed on Sep. 26, 2005, as Appl. No. 11/235,517. | ||
| Prior Publication US 2007/0070566 A1, Mar. 29, 2007 | ||
| Int. Cl. H02J 1/00 (2006.01) | ||
| U.S. Cl. 307—80 | 26 Claims |
| 1. A method to couple a module to a board including power circuitry, comprising:
detecting the module's power requirements before providing payload power to the module;
routing a regulated power level to the module via a power feed based on the detected power requirements, wherein the regulated
power level is provided by the board's power circuitry; and
routing another regulated power level to the module via another power feed based on a fixed power requirement, the other regulated
power level from among the plurality of regulated power levels.
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