| US 7,525,191 B2 | ||
| Semiconductor light source device | ||
| Norio Nakazato, Inzai (Japan); and Kimihiko Sudo, Hitachinaka (Japan) | ||
| Assigned to Hitachi, Ltd., Tokyo (Japan) | ||
| Filed on Apr. 07, 2006, as Appl. No. 11/399,607. | ||
| Claims priority of application No. 2005-111794 (JP), filed on Apr. 08, 2005. | ||
| Prior Publication US 2006/0261351 A1, Nov. 23, 2006 | ||
| Int. Cl. H01L 23/34 (2006.01); H01L 31/0232 (2006.01) | ||
| U.S. Cl. 257—713 [257/706; 257/88; 257/432; 257/E23.082] | 16 Claims |
| 1. A semiconductor light source device, comprising:
a heat diffusion plate;
a plurality of light emitting diode chips arranged in an array, the light emitting diode chips disposed above said heat diffusion
plate; and
thermoelectric cooling elements for cooling the plurality of the light emitting diode chips, wherein portions of a pair of
Peltier elements making up the thermoelectric element for cooling each of the plurality of the light emitting diode chips,
are electrically connected in series, through a portion of each of the plurality of the light emitting diode chips, and thereby
forming said light emitting diode chips and said thermoelectric elements as a unit electrically, respectively, on said heat
diffusion plate;
wherein the light emitting diode chip connected with the pair of Peltier elements on an electrode thereof drives a pulse current.
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