| US 7,525,179 B2 | ||
| Lead frame structure with aperture or groove for flip chip in a leaded molded package | ||
| Rajeev Joshi, Cupertino, Calif. (US); and Chung-Lin Wu, San Jose, Calif. (US) | ||
| Assigned to Fairchild Semiconductor Corporation, South Portland, Me. (US) | ||
| Filed on Jun. 06, 2006, as Appl. No. 11/448,962. | ||
| Application 11/448962 is a division of application No. 11/051061, filed on Feb. 04, 2005, granted, now 7,081,666. | ||
| Application 11/051061 is a division of application No. 10/411688, filed on Apr. 11, 2003, granted, now 6,867,481. | ||
| Prior Publication US 2006/0284291 A1, Dec. 21, 2006 | ||
| Int. Cl. H01L 23/495 (2006.01); H01L 23/28 (2006.01) | ||
| U.S. Cl. 257—666 [257/E23.033; 257/E23.069; 257/669; 257/671; 257/672; 257/674; 257/696; 257/698; 257/712; 257/713; 257/E23.046; 257/676; 257/778] | 18 Claims |
| 1. A semiconductor die package comprising:
a semiconductor die including a first surface and a second surface;
a leadframe structure comprising a die attach region and a plurality of leads extending away from the die attach region, wherein
the die attach region is attached to the first surface of the semiconductor die and includes one or more grooves in the die
attach region, and wherein the semiconductor die is mounted on the die attach region of the leadframe structure using one
or more conductive bumps each comprising a conductive material that is disposed in the one or more grooves, such that the
one or more conductive bumps are within the one or more grooves;
a molding material that is around at least portions of the die attach region of the leadframe structure and the semiconductor
die; and
a conductive structure attached to the second surface of the semiconductor die.
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