| US 7,524,703 B2 | ||
| Integrated circuit stacking system and method | ||
| James W. Cady, Austin, Tex. (US); James Wilder, Austin, Tex. (US); David L. Roper, Austin, Tex. (US); and James Douglas Wehrly, Jr., Austin, Tex. (US) | ||
| Assigned to Entorian Technologies, LP, Austin, Tex. (US) | ||
| Filed on Sep. 07, 2005, as Appl. No. 11/221,597. | ||
| Application 11/221597 is a division of application No. 10/814532, filed on Mar. 31, 2004, granted, now 6,956,284. | ||
| Application 10/814532 is a continuation in part of application No. PCT/US03/29000, filed on Sep. 15, 2003. | ||
| Application PCT/US03/29000 is a continuation in part of application No. 10/453398, filed on Jun. 03, 2003, granted, now 6,914,324. | ||
| Application 10/453398 is a continuation in part of application No. 10/005581, filed on Oct. 26, 2001, granted, now 6,576,992. | ||
| Prior Publication US 2006/0008945 A1, Jan. 12, 2006 | ||
| Int. Cl. H01L 21/00 (2006.01) | ||
| U.S. Cl. 438—125 [438/109; 438/122; 257/686; 257/706; 257/707; 257/724; 257/725] | 13 Claims |
| 1. A method of making a high-density circuit module comprising the steps of:
(a) placing first and second CSPs in non-contiguous positions on a flex circuit such that a first set of CSP contacts on a
bottom major surface of the first CSP and a second set of CSP contacts on a bottom major surface of the second CSP are both
connected to respective ones of a plurality of flex contacts;
(b) fixing at least one thermally conductive radiating form standard element at least partially along a lateral perimeter
of at least one of the first and second CSPs;
(c) fixing a heat spreader form standard element on a top major surface of the first CSP and in thermally conductive contact
with the at least one thermally conductive radiating form standard element;
(d) folding the flex circuit so that a top major surface of the second CSP is adjacent to the heat spreader form standard
element.
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