| US 7,524,563 B2 | ||
| Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same | ||
| Toru Nakanishi, Setagaya-ku (Japan); Kazunori Kondo, Kamisu (Japan); Shigehiro Hoshida, Narita (Japan); and Tadashi Amano, Kamisu (Japan) | ||
| Assigned to Shin-Etsu Chemical Co., Ltd., Tokyo (Japan) | ||
| Filed on Apr. 12, 2006, as Appl. No. 11/401,870. | ||
| Claims priority of application No. 2005-116093 (JP), filed on Apr. 13, 2005; and application No. 2005-136665 (JP), filed on May 09, 2005. | ||
| Prior Publication US 2006/0234044 A1, Oct. 19, 2006 | ||
| Int. Cl. B32B 27/38 (2006.01); B32B 37/12 (2006.01); C08L 63/00 (2006.01); C09J 163/00 (2006.01) | ||
| U.S. Cl. 428—416 [428/413; 428/414; 428/418; 428/473.5; 523/451; 525/523; 156/330] | 22 Claims |
| 20. A flexible copper-clad laminate, having an electrically insulating film, a layer of a semi-cured or completely cured product
of a flame retardant adhesive composition, and copper foil, wherein said composition is applied to a surface of said electrically
insulating film to form a coated surface, said coated surface further bonded to a side of said copper film to form said laminate;
wherein said flame retardant adhesive composition comprises:
(A) a halogen-free epoxy resin;
(B) a thermoplastic resin, a synthetic rubber, or a combination thereof;
(C) a curing agent;
(D) a phytate compound; and
(E) a curing accelerator.
|