| US 7,524,557 B2 | ||
| Highly heat conductive insulating member, method of manufacturing the same and electromagnetic device | ||
| Tetsushi Okamoto, Tokyo (Japan); Hiroyoshi Tsuchiya, Tokyo (Japan); Fumio Sawa, Tokyo (Japan); Noriyuki Iwata, Tokyo (Japan); Mitsuhiko Koyama, Tokyo (Japan); Yukio Suzuki, Tokyo (Japan); Akihiko Suzuki, Tokyo (Japan); Tooru Ootaka, Tokyo (Japan); Shigehito Ishii, Tokyo (Japan); and Susumu Nagano, Tokyo (Japan) | ||
| Assigned to Kabushiki Kaisha Toshiba, Tokyo (Japan) | ||
| Filed on Jan. 04, 2005, as Appl. No. 11/28,227. | ||
| Application 11/028227 is a continuation of application No. PCT/JP03/08564, filed on Jul. 04, 2003. | ||
| Claims priority of application No. 2002-196363 (JP), filed on Jul. 04, 2002; and application No. 2003-144919 (JP), filed on May 22, 2003. | ||
| Prior Publication US 2005/0208301 A1, Sep. 22, 2005 | ||
| Int. Cl. B32B 5/66 (2006.01) | ||
| U.S. Cl. 428—323 [428/328; 428/402; 428/403; 428/404; 428/407] | 7 Claims |
| 1. A highly heat conductive member used for insulating an electromagnetic device, and the member formed into a tape-like or
sheet-like shape, comprising:
a mica tape;
a backing material layer adhered to the mica tape;
a resin matrix included in the backing material layer;
first particles having a heat conductivity of 1 W/mK or higher and 300 W/mK or lower, and diffused in the backing material
layer; and
second particles having a diameter which is 0.15 or less times smaller than that of the first particles and having a heat
conductivity of 0.5 W/mK or higher and 300 W/mK or lower, the second particles diffused in the backing material layer, and
contained in the backing material layer in an amount of 0.5% by volume or more.
|