| US 7,524,429 B2 | ||
| Method of manufacturing double-sided printed circuit board | ||
| Hung-En Hsu, Taipei (Taiwan); Binwei Wang, Taipei (Taiwan); and Shing-Fun Ho, Taipei (Taiwan) | ||
| Assigned to Nan Ya Printed Circuit Board Corporation, Taoyuan (Taiwan) | ||
| Filed on Dec. 14, 2006, as Appl. No. 11/610,512. | ||
| Application 11/610512 is a continuation in part of application No. 11/160067, filed on Jun. 07, 2005, abandoned. | ||
| Claims priority of application No. 93127598 A (TW), filed on Sep. 10, 2004. | ||
| Prior Publication US 2007/0084823 A1, Apr. 19, 2007 | ||
| Int. Cl. H01B 13/00 (2006.01) | ||
| U.S. Cl. 216—18 [216/13; 216/17; 205/125] | 6 Claims |
| 1. A method of fabricating a printed circuit board, comprising:
providing a copper clad laminate (CCL) comprising an insulating substrate sandwiched by copper clads, the copper clads having
thereon a plurality of copper teeth inlaid into respective surfaces of the insulating substrate;
completely removing the copper clads and the copper teeth thereof from the surfaces of the insulating substrate, leaving recesses
on the surfaces of the insulating substrate, which increases surface roughness of the insulating substrate;
after completely removing the copper clads, laser drilling the insulating substrate to form at least one through hole;
plating a chemical copper layer on the insulating substrate and sidewall of the through hole;
forming a wire pattern on the surfaces of the insulating substrate, wherein the wire pattern includes at least one contact
pad;
forming a solder resistant layer on the surface of the insulating substrate, wherein the solder resistant layer has at least
one opening exposing the contact pad; and
coating a protective layer on the contact pad.
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