| US 7,524,394 B2 | ||
| Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same | ||
| Toru Nakanishi, Setagaya-ku (Japan); Kazunori Kondo, Kamisu (Japan); Shigehiro Hoshida, Narita (Japan); and Tadashi Amano, Kamisu (Japan) | ||
| Assigned to Shin-Etsu Chemical Co., Ltd., Tokyo (Japan) | ||
| Filed on Apr. 12, 2006, as Appl. No. 11/401,854. | ||
| Claims priority of application No. 2005-116115 (JP), filed on Apr. 13, 2005; application No. 2005-136667 (JP), filed on May 09, 2005; and application No. 2005-283648 (JP), filed on Sep. 29, 2005. | ||
| Prior Publication US 2006/0234043 A1, Oct. 19, 2006 | ||
| Int. Cl. B32B 37/12 (2006.01); B32B 27/38 (2006.01); C08L 63/00 (2006.01); C09J 163/00 (2006.01) | ||
| U.S. Cl. 156—330 [428/413; 428/414; 428/416; 428/418; 428/473.5; 523/451; 525/523] | 16 Claims |
| 1. A flame retardant adhesive composition comprising:
(A) a halogen-free epoxy resin;
(B) a thermoplastic resin and/or a synthetic rubber;
(C) a curing agent;
(D) a nitrogen-containing polyphosphate compound; and
(E) a curing accelerator; wherein
the nitrogen-containing polyphosphate compound is a combination of a salt of a polyphosphoric acid and melamine, and a salt
of a polyphosphoric acid and piperazine.
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