| US 7,524,391 B2 | ||
| Optical device and method for manufacturing the same, and electronic apparatus | ||
| Kazunori Sakurai, Suwa (Japan) | ||
| Assigned to Seiko Epson Corporation, (Japan) | ||
| Filed on Jun. 10, 2004, as Appl. No. 10/865,247. | ||
| Application 10/865247 is a division of application No. 10/032227, filed on Dec. 21, 2001, granted, now 6,765,236. | ||
| Claims priority of application No. 2000-395112 (JP), filed on Dec. 26, 2000. | ||
| Prior Publication US 2004/0232572 A1, Nov. 25, 2004 | ||
| Int. Cl. B32B 37/02 (2006.01); B32B 37/14 (2006.01); H01L 23/36 (2006.01); H01L 33/00 (2006.01); B32B 37/12 (2006.01) | ||
| U.S. Cl. 156—293 [156/290; 156/295; 156/298; 156/299; 156/300; 257/98; 257/99; 257/432; 257/724] | 4 Claims |
| 1. A method of manufacturing an optical device that includes a substrate having a through-hole, an upper surface and a lower
surface, and an optical element having an optical section placed to face the through hole, the method comprising:
mounting the optical element to the lower surface of the substrate;
disposing a spacer on a portion of the upper surface of the substrate;
disposing a light transmissive under-fill material between the lower surface of the substrate and the optical element, at
the through-hole and on the spacer; and
disposing a light transmissive member on the light transmissive under-fill material.
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