US 7,523,914 B2
High-hardness and corrosion-tolerant integrated circuit packing mold
Yin Yu Chang, 235 Chung-Ho Box 8-24, Taipei (Taiwan); Da Yung Wang, 235 Chung-Ho Box 8-24, Taipei (Taiwan); and Shien Chen Liu, 235 Chung-Ho Box 8-24, Taipei (Taiwan)
Filed on Jul. 01, 2005, as Appl. No. 11/172,028.
Prior Publication US 2007/0001268 A1, Jan. 04, 2007
Int. Cl. B29C 45/14 (2006.01); B29C 33/56 (2006.01); H01L 21/56 (2006.01)
U.S. Cl. 249—114.1  [425/116] 7 Claims
OG exemplary drawing
 
1. A high-hardness and corrosion-tolerant integrated circuit packing mold comprising:
a package mold including at least one filling channel, at least one mold cavity, and at least one channel between the mold cavities;
a protecting layer deposited upon surfaces of the package mold and the protecting layer being an amorphous coating layer;
wherein the protecting layer is a multilayer structure formed by at least one amorphous coating layer and at least one polycrystal coating layer; and
wherein the polycrystal coating layer is selected from one of polycrystal metals, polycrystal metal nitrides, polycrystal metal carbides, polycrystal metal carbide-nitrides, where the metal is one of transition metals.