| US 7,523,541 B2 | ||
| Method for manufacturing radio frequency IC tag | ||
| Isao Sakama, Hiratsuka (Japan); and Minoru Ashizawa, Tokyo (Japan) | ||
| Assigned to Hitachi, Ltd., Tokyo (Japan) | ||
| Filed on Mar. 13, 2008, as Appl. No. 12/76,030. | ||
| Application 12/076030 is a division of application No. 11/300282, filed on Dec. 15, 2005, granted, now 7,365,686. | ||
| Claims priority of application No. 2005-158110 (JP), filed on May 30, 2005. | ||
| Prior Publication US 2008/0172860 A1, Jul. 24, 2008 | ||
| Int. Cl. H01P 11/00 (2006.01) | ||
| U.S. Cl. 29—600 [29/592.1; 29/601; 340/572.7; 343/700 MS] | 19 Claims |
| 1. A method for manufacturing a radio frequency IC tag including an IC chip for recording information and an antenna for transmitting
the information recorded in the IC chip by radio, comprising the steps of:
forming a lead frame including a radiating electrode having a neck part and radiating parts of radio wave spreading on both
sides of the neck part and a ground electrode connected to the radiating part;
mounting the IC chip in the neck part;
injecting resin into the radiating electrode;
hardening the injected resin;
coating a portion of the lead frame projecting outside of the radiating electrode with a protection agent;
cutting the radiating electrode from the lead frame; and
forming the ground electrode along the surface of the hardened resin.
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