| US 7,522,413 B2 | ||
| Heat dissipating system | ||
| Hui Yu, Shenzhen (China); and Mu-Chang Wang, Taipei Hsien (Taiwan) | ||
| Assigned to Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Shenzhen, Guangdong Province (China); and Hon Hai Precision Industry Co., Ltd., Tu-Cheng, Taipei Hsien (Taiwan) | ||
| Filed on Aug. 21, 2007, as Appl. No. 11/842,172. | ||
| Claims priority of application No. 2007 1 0201075 (CN), filed on Jul. 13, 2007. | ||
| Prior Publication US 2009/0016017 A1, Jan. 15, 2009 | ||
| Int. Cl. H05K 7/20 (2006.01) | ||
| U.S. Cl. 361—687 [345/173; 62/259.2; 165/122] | 9 Claims |
| 1. A heat dissipating system, comprising:
a computer enclosure having a bottom panel;
a motherboard mounted on and substantially parallel to the bottom panel;
at least one dividing panel perpendicularly attached to the motherboard, the computer enclosure and the at least one dividing
panel cooperatively forming at least two heat dissipating chambers;
at least one heat generating element disposed in each of the at least two chambers; and
at least one heat dissipating device disposed in each of the at least two heat dissipating chambers.
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