| US 7,522,384 B2 | ||
| Method of head stack assembly flexible circuit assembly attached to an actuator arm | ||
| Yiu Sing Ho, Ma On Shan Shatin (Hong Kong Special Administrative Region of the People's Republic of China, The); Hiroshi Fukaya, Tai Koo Shing (Hong Kong Special Administrative Region of the People's Republic of China, The); Kam Fung Yip, Tuen Mun (Hong Kong Special Administrative Region of the People's Republic of China, The); Satoshi Yamaguchi, Kowloon (Hong Kong Special Administrative Region of the People's Republic of China, The); Jeffery L. Wang, Tai Po (Hong Kong Special Administrative Region of the People's Republic of China, The); and Can Hua Chen, Dongguan (China) | ||
| Assigned to SAE Magnetics (H.K.) Ltd., Shatin, N.T. (Hong Kong Special Administrative Region of the People's Republic of China, The) | ||
| Filed on Jan. 07, 2004, as Appl. No. 10/753,911. | ||
| Claims priority of application No. PCT/CN03/00570 (WO), filed on Jul. 18, 2003. | ||
| Prior Publication US 2005/0013055 A1, Jan. 20, 2005 | ||
| Int. Cl. G11B 5/55 (2006.01) | ||
| U.S. Cl. 360—264.2 | 18 Claims |
| 1. A head stack assembly (HSA) circuit assembly, comprising:
at least one actuator pad to be electrically coupled to a printed circuit board;
a flexible circuit substrate to electrically couple a slider to the at least one actuator pad; and
a stiffener to be mounted between the flexible circuit substrate and an actuator arm wherein the stiffener is mounted to the
actuator by soldering at least one pin extending from the actuator arm through the stiffener and the flexible substrate and
wherein the at least one pin extends in direct contact with the stiffener and the flexible substrate.
|