| US 7,521,947 B2 | ||
| Probe needle protection method for high current probe testing of power devices | ||
| Gary Rogers, Mesa, Ariz. (US); Steve Clauter, Tempe, Ariz. (US); Rodney Schwartz, Tiki Island, Tex. (US); Taichi Ukai, Tokyo (Japan); Joe Lambright, Gilbert, Ariz. (US); and Dave Lohr, Chandler, Ariz. (US) | ||
| Assigned to Integrated Technology Corporation, Tempe, Ariz. (US) | ||
| Filed on May 23, 2007, as Appl. No. 11/752,526. | ||
| Claims priority of provisional application 60/747981, filed on May 23, 2006. | ||
| Prior Publication US 2008/0290882 A1, Nov. 27, 2008 | ||
| Int. Cl. G01R 31/02 (2006.01); G01R 31/26 (2006.01); G01R 1/00 (2006.01) | ||
| U.S. Cl. 324—754 [324/110; 324/757; 324/765] | 24 Claims |
| 1. A test apparatus for applying high current test stimuli to a semiconductor device in wafer or chip form, said semiconductor
device including a plurality of contact points, comprising:
a plurality of probes for electrically coupling to respective ones of the plurality of contact points on the semiconductor
device;
a plurality of current limiters electrically coupled to respective ones of the plurality of probes, said current limiters
operative to limit current flow in a corresponding probe; and
a current sensor electrically coupled to each of the plurality of probes, said current sensor operative to provide a signal
when detected current in any probe exceeds a predetermined level.
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