| US 7,521,290 B2 | ||
| Method of manufacturing circuit device | ||
| Sadamichi Takakusaki, Gunma (Japan); and Noriaki Sakamoto, Gunma (Japan) | ||
| Assigned to Sanyo Electric Co., Ltd., Osaka (Japan) | ||
| Filed on Jan. 11, 2007, as Appl. No. 11/622,198. | ||
| Claims priority of application No. 2006-044882 (JP), filed on Feb. 22, 2006. | ||
| Prior Publication US 2007/0193027 A1, Aug. 23, 2007 | ||
| Int. Cl. H01L 21/50 (2006.01); H01L 21/48 (2006.01); H01L 21/44 (2006.01) | ||
| U.S. Cl. 438—111 [438/110; 438/112; 438/123; 438/106] | 6 Claims |
| 1. A method of manufacturing a circuit device in which electric circuits each including conductive patterns and circuit elements
are mounted on surfaces of circuit boards, and in which leads are fixed respectively to pads each made of the conductive pattern,
the method comprising the steps of:
preparing a substrate in which the plurality of the circuit boards are integrally connected to one another, each of the circuit
boards having the conductive patterns which include the pads formed on the surface of the circuit board;
electrically connecting the circuit elements to the respective conductive patterns on each of the circuit boards;
positioning ends of the plurality of leads above the respective pads by superposing a lead frame including the leads on the
substrate, and fixing the leads to the respective pads; and
separating the circuit boards from the substrate in a state where the leads are fixed to the respective pad on each of the
circuit boards, and separating the leads from the lead frame.
|