| US 7,521,157 B2 | ||
| Cross-shaped sub-resolution assist feature | ||
| Charles H. Wallace, Portland, Oreg. (US); Swaminathan Sivakumar, Portland, Oreg. (US); and Shannon E. Daviess, Hillsboro, Oreg. (US) | ||
| Assigned to Intel Corporation, Santa Clara, Calif. (US) | ||
| Filed on Feb. 09, 2006, as Appl. No. 11/351,084. | ||
| Prior Publication US 2007/0184355 A1, Aug. 09, 2007 | ||
| Int. Cl. G03F 1/00 (2006.01) | ||
| U.S. Cl. 430—5 | 19 Claims |
| 1. A method comprising:
using a cross-shaped sub-resolution assist feature to print a semiconductor pattern; and
causing the sub-resolution assist feature to intersect a main feature to be printed.
|