| US 7,521,122 B2 | ||
| Laminated sheet | ||
| Hiroshi Noro, Ibaraki (Japan); Koji Akazawa, Ibaraki (Japan); Masayuki Yamamoto, Ibaraki (Japan); and Yasuhiko Yamamoto, Ibaraki (Japan) | ||
| Assigned to Nitto Denko Corporation, Ibaraki-shi (Japan) | ||
| Filed on Jun. 28, 2004, as Appl. No. 10/876,651. | ||
| Claims priority of application No. 2003-196113 (JP), filed on Jul. 11, 2003. | ||
| Prior Publication US 2005/0008873 A1, Jan. 13, 2005 | ||
| Int. Cl. B32B 27/00 (2006.01); H01L 21/00 (2006.01) | ||
| U.S. Cl. 428—423.1 [428/212; 428/195.1; 428/336; 428/423.7; 428/620; 29/592.1; 438/460] | 6 Claims |
| 1. A laminated sheet for adhering to a circuit side of a projected electrode-mounting wafer in a step of grinding a backside
of the wafer, wherein the laminated sheet comprises at least:
a layer (layer A) contacting with the circuit side, made of a thermosetting resin;
a layer (layer B) directly laminated on the layer A, made of a thermoplastic resin having a tensile modulus of from 1 to 300
MPa at 40 ° to 80° C.; and
an outermost layer (layer C) directly laminated on the layer B, comprising at least a non-plastic thermoplastic resin layer
at 25° C.,
wherein h, At and Bt satisfy the relationships of:
At<h and (At+Bt)>h, wherein h is a height of the projected electrode, At is thickness of the layer A, and Bt is a thickness of the layer B,
wherein the layer C has tensile modulus of from 1000 to 3000 Mpa at 40° to 80 ° C.
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