	US 7,521,116 B2
	Pressure sensitive adhesive tapes from cationic cure adhesives
Charles W. Paul, Madison, N.J. (US); Peter A. Walter, Hampton, N.J. (US); and Cynthia L. Meisner, Monmouth Junction, N.J. (US)
Assigned to Henkel AG & Co. KGaA, Duesseldorf (Germany)
Filed on May 30, 2006, as Appl. No. 11/443,381.
Application 11/443381 is a division of application No. 10/412840, filed on Apr. 11, 2003.
Prior Publication US 2006/0216521 A1, Sep. 28, 2006
Int. Cl. B32B 27/38 (2006.01); B32B 7/12 (2006.01); B32B 37/14 (2006.01)

U.S. Cl. 428—355EP [428/355 R; 428/413; 428/414]

14 Claims

1. A pressure sensitive adhesive article prepared by a process comprising:

coating a cationic curable adhesive onto a paper film substrate having a moisture content of less than about 5%, initiating cure of the adhesive, optionally applying a second film substrate to said coated paper film substrate, said second film substrate having a moisture content of less than about 5%, and maintaining the moisture content of the paper film substrate and the optional second film substrate at a level of less than about 5% for a period of time, allowing the adhesive to substantially fully cure.