| US 7,521,011 B2 | ||
| Semiconductor-sealing-purpose epoxy resin compound producing method | ||
| Mitsuo Ishikawara, Oyama (Japan); Kouji Taya, Shimodate (Japan); Rikiya Kobayashi, Shimodate (Japan); Hideki Ebihara, Souwa-machi (Japan); and Tateo Yamada, Yuki (Japan) | ||
| Assigned to Hitachi Chemical Company, Ltd., Tokyo (Japan) | ||
| Appl. No. 10/526,008 PCT Filed Jan. 30, 2004, PCT No. PCT/JP2004/000945 § 371(c)(1), (2), (4) Date Feb. 25, 2005, PCT Pub. No. WO2004/067244, PCT Pub. Date Aug. 12, 2004. |
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| Claims priority of application No. 2003-022571 (JP), filed on Jan. 30, 2003. | ||
| Prior Publication US 2006/0017188 A1, Jan. 26, 2006 | ||
| Int. Cl. B29C 47/38 (2006.01) | ||
| U.S. Cl. 264—211.21 [366/101; 366/107] | 5 Claims |
| 1. A method of manufacturing an epoxy resin composition for semiconductor encapsulating by use of a kneader provided with
a suction hole on the downstream side of a kneading region in a conveying direction of the epoxy resin composition, and being
provided with a supply orifice and a discharge orifice respectively disposed on the upstream side and the downstream side
in the conveying direction of the epoxy resin composition, wherein the kneading region is from the downstream side of the
supply orifice to the upstream side of the discharge orifice, the method comprising:
kneading the epoxy resin composition, while discharging a volatile gas in the kneader out of the kneader through the suction
hole, and simultaneously introducing outside air to the kneader through the supply orifice and the discharge orifice.
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