| US 7,520,416 B2 | ||
| Transparent window with non-transparent contact surface for a soldering bonding | ||
| Richard Crumbach, Aachen (Germany); Bernhard Reul, Herzogenrath (Germany); and Andreas Sznerski, Baesweiler (Germany) | ||
| Assigned to Saint-Gobain Glass France, Courbevoie (France) | ||
| Appl. No. 10/526,931 PCT Filed Oct. 15, 2003, PCT No. PCT/FR03/03034 § 371(c)(1), (2), (4) Date Mar. 08, 2005, PCT Pub. No. WO2004/040944, PCT Pub. Date May 13, 2004. |
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| Claims priority of application No. 102 49 992 (DE), filed on Oct. 26, 2002. | ||
| Prior Publication US 2006/0126196 A1, Jun. 15, 2006 | ||
| Int. Cl. B23K 31/02 (2006.01); H05B 3/16 (2006.01) | ||
| U.S. Cl. 228—121 [219/543; 219/203] | 10 Claims |
| 1. A transparent pane comprising:
at least one electroconducting, non-transparent contact surface placed on a surface of the pane, to connect it by soldering
to a connection piece, the contact surface including at least one cutout,
wherein, in a region of the soldering location, the at least one cutout of the contact surface is configured to be at least
partially filled with a soldering filler metal, the filler being visible through the pane after the connection piece has been
soldered to the contact surface.
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