US 7,520,285 B2
Apparatus and method for processing a substrate
James P. Garcia, Santa Clara, Calif. (US)
Assigned to Lam Research Corporation, Fremont, Calif. (US)
Filed on Sep. 30, 2004, as Appl. No. 10/957,260.
Application 10/957260 is a continuation in part of application No. 10/261839, filed on Sep. 30, 2002, granted, now 7,234,477.
Prior Publication US 2006/0005860 A1, Jan. 12, 2006
This patent is subject to a terminal disclaimer.
Int. Cl. B08B 3/00 (2006.01)
U.S. Cl. 134—98.1  [134/94.1; 134/99.1; 134/902] 13 Claims
OG exemplary drawing
 
1. An apparatus for processing a substrate, comprising:
a proximity head having a head surface, the proximity head having a plurality of regions for delivering fluid and a plurality of regions for removing fluid, wherein at least one of the plurality of regions for delivering fluid further comprises a plurality of conduits substantially aligned along a length of the proximity head for delivering fluid;
a fluid input and a fluid output coupled to the proximity head, the fluid input configured to supply a fluid to the plurality of regions for delivering fluid and the fluid output configured to remove the fluid through the plurality of regions for removing fluid so as to define a segment of a fluid meniscus between the head surface of the proximity head and the top surface of the substrate; and
a fluid flow control device for managing fluid flow through the fluid input, the fluid flow control device having a plurality of restrictors aligned along a length of the proximity head, with each restrictor being associated with one of said conduits for setting either an on flow, an off flow, or a partial flow through selected ones of the plurality of conduits for delivering fluid, so as to define a size of the meniscus along the length of the proximity head;
wherein the proximity head is configured for placement over a top surface of the substrate, such that the head surface of the proximity head faces down over the top surface, and is spaced apart from the top surface.