| US 7,519,880 B1 | ||
| Burn-in using system-level test hardware | ||
| Trent William Johnson, Austin, Tex. (US); Steven Russell Klassen, Buda, Tex. (US); Jeff Brinkley, Georgetown, Tex. (US); Glenn Eubank, Austin, Tex. (US); John Heon Yi, Austin, Tex. (US); Satwant Singh, San Jose, Calif. (US); Michael Gregory Tarin, Austin, Tex. (US); and Chandrakant Pandya, Pflugerville, Tex. (US) | ||
| Assigned to Advanced Micro Devices, Inc., Sunnyvale, Calif. (US) | ||
| Filed on Jul. 05, 2005, as Appl. No. 11/174,823. | ||
| Int. Cl. G01R 31/28 (2006.01) | ||
| U.S. Cl. 714—724 [714/718; 714/721; 714/726; 714/727; 714/728; 714/729; 714/731; 714/744] | 18 Claims |
| 1. A burn-in test system comprising:
a device under test (DUT);
a temperature controller coupled to the DUT;
a test controller configured to:
set a parameter of the DUT to a first value and apply a test stimulus to the DUT;
set the parameter of the DUT to a second value and apply the test stimulus to the DUT;
wherein the parameter is clock speed, a change in the value of the parameter results in a change in the amount of heat dissipated
by the DUT, and the parameter is not used to control the temperature of the DUT;
wherein the temperature controller is configured to maintain the DUT at a pre-determined temperature during testing with the
parameter set to both the first and the second values by heating the DUT;
wherein if setting the parameter to the second value causes an increase in the heat dissipation within the DUT, the temperature
controller is configured to reduce heating of the DUT in response in order to maintain the DUT at the pre-determined temperature;
and
wherein if setting the parameter to the second value causes a decrease in the heat dissipation within the DUT, the temperature
controller is configured to increase heating of the DUT in response in order to maintain the DUT at the pre-determined temperature.
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