| US 7,519,447 B1 | ||
| Method and apparatus for integrating multiple sample plans | ||
| Christopher A. Bode, Austin, Tex. (US); and Kevin R. Lensing, Austin, Tex. (US) | ||
| Assigned to Advanced Micro Devices, Inc., Austin, Tex. (US) | ||
| Filed on Oct. 05, 2004, as Appl. No. 10/958,949. | ||
| Int. Cl. G06F 19/00 (2006.01) | ||
| U.S. Cl. 700—110 [700/109; 700/121; 700/31; 438/16] | 22 Claims |
| 1. A method, comprising:
receiving a first wafer state data set from a first wafer measurement device, the first wafer state data set being indicative
of at least one characteristic of at least one wafer processed by a processing tool to form a portion of an electronic component
of a semiconductor device, the electronic component being formed above said at least one wafer by the processing tool;
receiving a second wafer state data set from a second wafer measurement device, the second wafer state data set being indicative
of the at least one characteristic of the at least one wafer processed by the processing tool;
determining a sampling plan for at least one third measurement device in response to determining whether the first and second
wafer state data sets adequately characterize said at least one characteristic of said at least one wafer;
receiving at least one third wafer state data set from the third wafer measurement device, the third wafer state data set
being collected according to the sampling plan and being indicative of said at least one characteristic of said at least one
wafer;
forming a fourth wafer state data set using the first, second, and third wafer state data sets; and
determining the at least one characteristic of the at least one wafer based upon the fourth wafer state data set.
|