US 7,518,871 B2
Liquid-based cooling system for cooling a multi-component electronics system
Levi A. Campbell, Poughkeepsie, N.Y. (US); Richard C. Chu, Hopewell Junction, N.Y. (US); Michael J. Ellsworth, Jr., Lagrangeville, N.Y. (US); Madhusudan K. Iyengar, Woodstock, N.Y. (US); Roger R. Schmidt, Poughkeepsie, N.Y. (US); and Robert E. Simons, Poughkeepsie, N.Y. (US)
Assigned to International Business Machines Corporation, Armonk, N.Y. (US)
Filed on Jul. 07, 2008, as Appl. No. 12/168,267.
Application 12/168267 is a continuation of application No. 11/539910, filed on Oct. 10, 2006, granted, now 7,420,808.
Prior Publication US 2008/0273307 A1, Nov. 06, 2008
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 7/20 (2006.01); F28F 7/00 (2006.01)
U.S. Cl. 361—702  [165/80.4; 361/699; 361/711] 15 Claims
OG exemplary drawing
 
1. A liquid-based cooling system for cooling an electronics system, the cooling system comprising:
a single piece, monolithic structure preconfigured for cooling multiple heat generating electronic components of the electronics system when coupled thereto, the single piece, monolithic structure comprising:
multiple liquid-cooled cold plates configured and disposed in spaced relation to engage respective heat generating electronic components of the multiple heat generating electronic components to be cooled;
a plurality of coolant-carrying tubes metallurgically, rigidly, permanently bonded in fluid communication with the multiple liquid-cooled cold plates; and
a liquid-coolant header subassembly metallurgically, rigidly, permanently bonded in fluid communication with multiple coolant-carrying tubes of the plurality of coolant-carrying tubes, the liquid-coolant header subassembly comprising a coolant supply header bonded in fluid communication with multiple coolant supply tubes of the multiple coolant-carrying tubes and a coolant return header bonded in fluid communication with coolant return tubes of the multiple coolant-carrying tubes, wherein when in use, the multiple liquid-cooled cold plates engage the respective heat generating electronic components of the multiple heat generating electronic components, and liquid coolant is distributed through the liquid-coolant header subassembly and plurality of coolant-carrying tubes to the multiple liquid-cooled cold plates for removal of heat generated by the respective heat generating electronic components.